Tuesday, May 17, 2016

Internship – Purchasing & Packaging– Henkel (posted on 18 May 2016)

Company
Henkel
Industry
Supply Chain
Location
Singapore
Position Type
Internship
Post Date
18 May 2016
Closing Date
n.a

Employer Description
Henkel operates worldwide with leading brands and technologies in three exciting business areas: Laundry & Home Care, Beauty Care and Adhesive Technologies. Our success is built on constant innovation and people who strive for excellence. Working at Henkel is much more than just a job. It’s a passion. Have you got what it takes?

Responsibilities
The still favorable economic environment in APAC region is attracting more and more players (local and international packaging producers) and competition is getter fiercer. On the other side the declining growth in the region results in an overcapacity of some feedstocks.
Value Chain mapping of the regional feedstock allows to grasp opportunities faster, as well as develop more adequate sourcing strategies. Packagings are mainly depending on paper, resin, steel and metal (tinplate/aluminum) feedstocks
Analyze and Identify the Supply Market, the feedstock market (local & import), and Logistics Network as well as feedstock pricing mechanism
Evaluate the feedstock trend in past&future by reviewing publications, tracking import/export data and interviewing supply base within the region. Define risk & opportunities for Henkel
This project should offer a clear “packaging feedstock” flow for APAC. incl. what are the feedstock opportunities and potential risks surrounding FX movements, complex logistics and/or Force Majeure (from in-& outside the region) to consider.
Should propose a decision matrix advising on best sourcing strategy vs. feedstock market trend

Qualifications
  • Graduate of a Bachelor’s or Masters degree Business Management, Supply Chain or related
  • Analytically strong and team-oriented, with an international mindset
  • Independent thinker who acts and decides objectively and with integrity
  • Excellent communication skills in English 

Application link




No comments:

Post a Comment